[UPDATE | 2nd Jan, 12:15 PM] –
Ahead of its impending launch on January 7, the Realme X50 5G has been extensively teased by the company on social media, revealing many of it key features and tech specs. Now, Realme’s Chief Marketing Officer, Xu Qi Chase, has posted a render of the upcoming device on Chinese micro-blogging site, Weibo, revealing its design in all its glory.
The company had earlier revealed that the Realme X50 5G will be powered by the Snapdragon 765G platform with support for dual-mode (SA+NSA) sub-6GHz 5G networks. The device has also been confirmed to ship with a dual-camera punch-hole design, liquid cooling with an 8mm diameter copper tube, and support for VOOC 4.0 fast-charge.